See also: International Electronics Forum 2009 - News Roundup
STMicroelectronics believes that process technology remains a key competitive differentiator, and is meeting the costs of owning that differentiation by collaboration with other companies and institutions, according to Jean-Marc Chery, executive vice president and chief technology officer of STMicroelectronics at the first day of the International Electronics Forum 2009 in Geneva today.
"We leverage our internal capabilities and multiple external sources to deliver to our business units the best competitive supply price", said Chery.
Chery instanced the European collaborative programmes like Nanotech 2012, ST's participation in the International Semiconductor Development Alliance (ISDA), CEA/LET, universities in France, Italy and the USA and research institutes in Singapore as all part of ST's external sources.
ISDA allows design compatibility (GDS2 protocol) between ST's fabs at IBM's technology development fab at East Fishkill, ST's fabs Crolles, Globalfoundries' fabs, Chatered's fabs and Samsung's fabs.
The next big thing, said Chery, is 3D integration. On the way to that is the integration of CMOS SOC and RF chips, and the integration of multiple radio ICs.
The importance of maintaining in-house process capabilities is commercial, as well as technological, said Chery. "Moving to a foundry providing the technology is a risk because price erosion can't be maintained", said Chery.
See also: Mannerisms, the blog of David Manners. Updated twice daily, it's the distinctive, entertaining, authoritative and never dull commentary on the semiconductor industry, from someone who knows. Sign up for the Mannerisms eNewsletter.