NXP is claiming a first, with a Schottky diode only 0.37mm thick.
"It is the smallest plastic package on the market and is capable of carrying a current of up to 1.5A", said the firm.
Called DFN1608D-2, "it has been released with a portfolio of six rectifiers: three 20V types optimised for low forward voltage [down to 410mV] and three 40V types optimized for low reverse current. Average forward current ranges between 0.5 and 1.5A", said NXP.
So far, two of the 20V types are in production and the other four are sampling, with production planned for March.
The SOD1608 package has a footprint of 1.6x0.8mm, with a large contact area underneath to take heat away.
Intended applications include battery charging, display backlighting, switched-mode PSUs and dc-dc conversion for small portable equipment like phones, or tablets for the higher rated devices.
"Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density," said NXP. "The ability to solder the package at the side also enables visual inspection of the contact."