Embedded board firms Congatec and Curtiss-Wright Controls have been quick to design the heavy-duty version of the Atom processor with extended temperature range into industrial modules.
Curtiss-Wright Controls Embedded Computing is using the Intel Atom processor Z5xx series on its recently introduced ruggedised VPX3-1100 ATOMIC board family.
Congatec has added heavy-duty industrial versions of its COM Express products with modules based on extended temperature versions of the Intel Atom processor Z5xx series and the system controller hub US15WPT.
All components are specified for an ambient temperature range of -40 to +85°C.
“This allows our customers to create modules that can be used in existing systems that need the industrial temperature range features for applications used in unconstrained thermal environments,” said Jonathan Luse, director of marketing, in the low power embedded products division at Intel.
Typical power requirements for this module are less than 5W.
The conga-CAx is available in two different CPU variants. One version is powered by the Atom processor Z510PT with 1.1GHz and 400MHz front side and memory bus.
The other version features the 1.33GHz Atom processor Z520PT. Both variants are equipped with 512k L2 cache and can access up to 1GByte of rugged onboard soldered DDR2 RAM.
The US15WPT has an integrated graphics memory accelerator 500 graphics engine. This 3D capable onboard graphics utilizes up to 256 MByte frame buffer and supports DirectX 9.0E and OpenGL 2.0.
The Atom processor Z5xx series features power management techniques such as new C6 state (Deep Power Down Technology) as well as split IO power supply support.
According to Lynn Patterson, vice president and general manager of Modular Solutions, Curtiss-Wright Controls Embedded Computing. “When combined with our innovative 2LM-ATS Perimeter Defense technology, the VPX3-1100 ATOMIC delivers a new breed of low power SBC that puts Curtiss-Wright at the forefront of embedded highly secure computing.”
The conga-CAx will be available mid-2009.
See more news at Embedded World 2009