Suppliers of Computer-on-Modules (COM) form factor embedded boards have thrown their weight behind the nanoETXexpress platform with the release of revision 1.0 of the specification.
The 84x55mm-sized version of the industry standard COM Express form-factor was originally initiated by Kontron, but has become more widely supported.
Embedded COM vendors Aaeon, Adlink and Advantech together with Kontron have jointly released the new specification, which now includes SDVO support.
The next step is to present it to the PICMG standards group for incorporation into one of the next COM Express releases under the proposed neutral name "Ultra".
Currently, the COM Express specification includes only the "Basic" (95x125mm) and "Extended" (110x155mm) form factors.
"We support the "Ultra" form factor because it fits perfectly into our product portfolio. We have already implemented the Intel Atom processor on our COM-U15 COM Express Computer-on-Module,” said Peter Yang, Aaeon product manager.
There is wide recognition that PICMG’s COM Express has become the main open industry standard in the area of small form factor boards.
“By proposing this new "Ultra" small form factor that remains fully pin and signal compatible with PICMG's COM Express Type 1, we can leverage COM Express success,” said Henk van Bremen, product director for Adlink's embedded division.
The companies are also proposing a 95x95mm nanoETXexpress module for incorporation into the COM Express specification.
Revision 1.0 of the nanoETXexpress Computer-on-Modules specification enables SDVO signal transport via a separate flat foil connector. The LVDS output on the COM Express connector can therefore also be retained and used alongside DVI, giving designers the possibility of designing-in extra graphic interfaces on the carrier board to enable dual display solutions.
Revision 1.0 of the nanoETXexpress specification can be downloaded from the website.
See more news at Embedded World 2009