Microsemi demos next-gen LEDsNews from E-InSiteMicrosemi has introduced its second family of blue LEDs and announced plans to develop a white LED. These next-generation LEDs will combine a derivative of the company’s patented packaging technology and a gallium nitride (GaN)-based die from Cree. They will form the basis for a line of high-power, high-brightness blue and white LEDs, the company said.
Microsemi claims it has more than 50 per cent of all design wins for LED drivers in next-generation PDAs.
The white LEDs are to be made in ultraviolet-resistant glass packages having no wire bonds, called LightChips. Microsemi last Friday demonstrated proof-of-concept silicon-based GaN die prototypes at the Strategies and Light Conference in California. Samples are expected by the summer with production starting by the end of the year.
This LightChip technology is based on Microsemi’s patented wafer scale MMSM chip technology and Nitronex’ Sigantic GaN on large area silicon wafer technology.
"The intent of LightChip is to open a new chapter in LED technologies," said Manuel Lynch, v-p of business development. "Our architecture will accelerate the merge of chip, package, phosphors and reflector cup at the wafer level and provide a clear application conscious roadmap that paves the way for using LEDs as viable alternatives for incandescent and fluorescent technologies."
The company already markets a blue LED device, the MegaBright UPBLED470B. The new UPBLED470A UltraBright was unveiled at the conference. Its new Optomite packaging technique allows higher power in a smaller surface mount package, the company said.
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See also: Electronics Weekly's roundup of content related to LEDs, both white LEDs and coloured LEDs.