The IC industry was pretty much sold out of capacity in Q1.
Worldwide 300mm wafer capacity was running at 97% in Q1 2011, according to Semiconductor International Capacity Statistics (SICAS). Foundry capacity was also running at 97%.
Eight inch wafer capacity was at 89.6% and sub-eight inch capacity was at 90.2%.
Processes better than 60nm were at 98.9% capacity utilisation, processes from 60nm to 80nm were at 95.8% utilisation, and processes between 80nm and 120nm were at 87.5% utilisation.
Processes from 0.12 micron to 0.22 micron were at 91.8% utilisation, from 0.22 micron to 0.4 micron they were at 88.2%, from 0.4 micron to 0.7 micron they were at 84.2% utilisation and for processes above 0.7 micron they were at 84.9%.
Total IC capacity was running at 94.2% and total discretes capacity was running at 89.4%.
For the industry as a whole, capacity utilisation was 93.7%.