Blundell Production Equipment is showing at Nepcon a twin soldering station from ERSA and a range of manual and semi-automatic pick and place equipment from Fritsch.
ERSA's I-CON2 complements the single I-CON station, and comes in three configurations.
The AC version is supplied with a 150Watt I-Tool on one side, and a desoldering chip tool on the other. An anti-twist mechanism incorporated in the chip tool ensures the paired tips provide precise and efficient component removal.
The AXT version comes with an I-Tool and X-Tool desoldering hand-piece, complete with its own compressor station. The X-Tool has twin heating elements positioned either side of the desoldering nozzle. In addition, removed solder is collected in a disposable paper cartridge that eliminates the need for glass tubes. Nozzles are quickly changed without the need for pliers or screwdrivers.
Finally, the AIT version is supplied with two I-Tools, which is particularly useful if swapping between tin/lead and lead-free technologies.
Each tool has separate programmable settings from the other. As with the standard I-CON, features such as auto standby to detect when not in use, password protection, process window alarm and fast programming via an I-SET TOOL (similar to a USB memory stick) have been copied across to the I-CON2.
Meanwhile, the Fritsch pick and place equipment includes an entry-level model, the LM900. This is a manual X-Y pick up system and is supplied with a 45-bin carousel. The self-contained vacuum supply to the head is switched on when a part is picked, and switches off after placement.
The LM901 is the next level system. Whilst manual in operation, it has the added option of having a solder paste or glue dispenser fitted alongside the placement head.
A PC directed version (SM902) prompting correct feeder pick locations and specific placement destinations is also available.
This system will not permit picking from the incorrect feeder position, and alert the operator should they place the component outside the programmed placement position. Device polarity is also identified during the assembly sequence.
Programming can be generated by self-teach digitisation or from an X-Y coordinate text file.