We roundup all the latest news and developments from the International Electronics Forum 2010 (IEF 2010) in Dresden, reported by our man on the spot, components editor David Manners.
Hosted by the analysts Future Horizons, the conference runs from 5th - 7th May.
IEF 2010
Thursday 6 May
TSMC CTO Expects 450mm Processing In 2015
TSMC, working with ASML and MAPPER, have developed a prototype multi-e-beam tool for semiconductor lithography, according to Dr Jack Sun, CTO of TSMC, speaking to the International Electronics Forum 2010 in Dresden this morning.
SIA Is Talking The Industry Down, says Future Horizons
The Semiconductor Industry Association (SIA) is talking the industry down, said Malcolm Penn, CEO of Future Horizons at his company's International Electronics Forum 2010 in Dresden today.
IMEC CEO Sees EUV As Next Gen Litho Tool
EUV is the most likely candidate for the next generation of IC lithography, said Luc Van den hove, president and CEO of IMEC, speaking at the International Electronics Forum 2010 in Dresden this morning.
IEF 2009
Friday 2 October
'Stakes of the chip industry have never been higher' - IEF 2009
Numonyx opens up on phase change RAM - IEF 2009
Pasquale Pistorio on the credit crunch & semi CEOs - IEF 2009
Thursday 1 October
Allocation is back on the agenda - IEF 2009
Cloud computing growing at 45% a year - IEF 2009
Broadband becoming a basic human need, says ST-Ericsson - IEF2009
Process technology remains key, says ST - IEF 2009
Collaboration is the way out of a crisis, says TSMC - IEF 2009
(Picture: Conference suite at Hôtel Ramada Encore Genève, the venue for IEF 2009.)
See also: Mannerisms, the blog of David Manners. Updated twice daily, it's the distinctive, entertaining, authoritative and never dull commentary on the semiconductor industry, from someone who knows. Sign up for the Mannerisms eNewsletter.