TSMC has joined Sematech to collaborate on semiconductor research and development for IC process technologies for 20nm generation and beyond.
The collaboration will cover EUV lithography, 3D interconnects, metrology, novel materials and device structures, and to develop infrastructure for next-generation manufacturing, including the transition to 450mm wafers, says a press release issued by both organisations.
Sematech manages an international network including foundries, IDMs, fabless semiconductor companies, packaging and assembly companies, and material and equipment suppliers, to address chip manufacturing challenges.
Sematech’s other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).
“This complementary cooperation leverages Sematech’s collaborative approach to lead critical industry technology transitions,” says Jack Sun, vice president and CTO, Research and Development of TSMC.
“TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies,” says Dan Armbrust, CEO of Sematech.