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Latest Issue: 23 - 29 May, 2012
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A concise roundup of the latest news from Electronica 2010, at the New Munich Trade Fair Centre.
Friday 12 November 2010
TI back to eight week lead-times in Q2
TSMC spends $5.9bn; hires 10,000 people
Electronica: Plessey expanding through standard products
Thursday 11 November 2010
EBV to sell own brand products
3D Hall sensor works off-axis
Vicor shows first AC-DC power module
Digi-Key joins support for future designers
Wednesday 10 November 2010
Atmel adds capacitive touch to Cortex-M3 microcontroller
Fab-lite is a 'no-cash' strategy, says TI
Micron facilitising Singapore fab
Farnell is rebranding as Element14
Atmel on a roll
Linear Tech can be $1.6bn company, says founder Swanson
NXP will out grow market in 2011, says CEO Clemmer
Structural change is taking place, says RS owner
Tuesday 9 November 2010
Intersil expanding away from computing
Renesas increasing automtive market share following shortages
Microsemi completes Actel integration
TI launches multicore DSP series
Don't waste a good crisis, Freescale v-p tells Electronica
Touchscreen RF signal generator
'We have 10-year product plans' - says Tektronix CEO
Xilinx Virtex-6 HXT for optical comms
MIPS multicores used in driver safety system
Monday 8 November 2010
Copper foam replaces heatsink microchannels
Freescale aims Power MCUs at cars
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