Ceva has announced availability of silicon for the 32-bit CEVA-TeakLite-III DSP core produced on the 90nm process of China chip foundary SMIC.
The DSP core, which is targetted at 3G mobile baseband system-on-chip designs, runs at over 600MHz.
"The dual-MAC, 32-bit processing architecture enables the core to reach operating speeds higher than 700MHz in 65nm process," said Ceva.
See: Ceva offers first comms processor for 4G
The IP developer is targetting the DSP core at low-cost 2G/2.5G/3G wireless baseband modems, wideband voice and audio processors, portable media players, voice-over-IP residential gateways and high definition audio applications, supporting advanced audio standards such as Dolby Digital Plus 7.1, Dolby TrueHD and DTS-HD.
“The availability of silicon for our 32-bit CEVA-TeakLite-III DSP core is a significant advancement for our DSP customers, eliminating any risk associated with DSP IP-based SoC design,” said Aviv Malinovitch, v-p operations at Ceva.
The core is available with a range of optimised HD audio codecs supporting from 2 channels up to 7.1 channels with various bit-rates. Audio codecs supported include: MP3, AAC-LC, HE-AAC, WMA, AC-3, RealAudio, Dolby Digital Plus, Dolby TrueHD, DTS, DTS-HD MA, DTS-HD HR and others.