ASML, the world’s top IC lithography company, had Q2 sales of €1.07bn, up from €744m in Q1, and Q2 net income of €239m compared to €107m in Q1.
“We now expect full year 2010 sales to grow 10 to 15 percent above our historical peak sales of €3.8bn,” says ASML CEO Eric Meurice, “this level of sales is expected to continue into 2011.”
ASML expects Q3 sales of around €1.1bn and gross margin of about 43%.
Driving demand are three factors:
The more than doubling, between 2009 and 2010, of the average number of immersion layer exposures due to the growing sub-50nm nodes mix, with a continued upward trend into 2011.
The memory makers’ upgrades to more advanced nodes with second tier DRAM manufacturers now transferring to 40nm nodes while leading DRAM vendors are preparing for 30nm node manufacturing, and NAND Flash manufacturers migrating to sub-30nm chip production.
Companies’ continued catch-up on under-investments of the past two to three years.
ASML’s order backlog is now valued at €2.4bn after Q2 bookings for 48 new systems and 11 used systems worth €1.18bn.
Q2 sales included 35 new and 8 used systems, totalling net system sales of €923m, and net service and field options sales of €146m. In Q1, 23 new and 11 used machines were shipped.
The Q2 ASP for a new system was €25.6m, compared with the Q1 ASP of €25.8m.
The Q2 2ASP for all ASML systems sold was €21.5m million, compared with the Q1 ASP of €18.6m.
Q2 bookings were for 59 systems, of both advanced immersion systems for critical layers and Kef systems for less critical layers for capacity additions, with a total ASP of €20m.
ASML’s systems backlog on June 27th was 101 systems with an average selling price of €23.8m million, reflecting a mix of systems for all chip layers. At the end of March the backlog was 85 systems.
The company expects to ship six EUV systems over the next 12 months.
ASML has now shipped almost 20 of its most advanced scanners, NXT 1950i, all of which have some ASML’s holistic lithography components which are claimed to deliver tighter tolerances and faster time to market.