Qualcomm has introduced a dual-core CPU device for next generation mobile computing handsets.
The QSD8672 chip features two 1.5GHz cores combined with the 3G mobile broadband and peripherals found on the firm’s existing Snapdragon handset chipsets.
The on-chip multi-mode modems include HSPA+ for up to 28Mbit/ on the downlink and up to 11Mbit/s on the uplink.
The chip integrates GPS, Bluetooth, 1080p high-definition video recording and playback and also supports Wi-Fi and mobile TV technologies such as MediaFLO, DVB-H and ISDB-T.
The integrated 2D and 3D graphics engines deliver device manufacturers the ability to offer products with display resolutions up to WSXGA (1440 x 900).
According to Qualcomm, the dual-core design will support mobile displays “from 9 to 12 inches in size with a form-factor that is smaller, thinner, lighter and quieter than laptops currently on the market”.
Sampling is scheduled for the second half of 2009.