Vishay has introduced a series of ceramic package bases for high-power LED die, with thermal resistance down to 3K/W.
The LSUB series is available in two configurations: 'standard', for conductive epoxy or thick solder (greater than 12μm) die attach, and 'offset' for thin (2-3μm) solder layers.
Designed to accommodate die that are approximately 1x1mm, the pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
LED and laser applications are expected, in automotive, industrial, and homes.
The bases are offered for single die and die in square arrays, with additional configurations and form factors are available upon request.
The LSUB is offered packaged in waffle packs or in wafer form for automatic die assembly.
Samples and production quantities of the new devices are available now, with lead times of seven to nine weeks for larger orders.
