Dalsa Semiconductor, a custom wafer foundry, is to license silicon metallisation technology from French firm Alchimer which will support its MEMS activities.
This follows tests by Quebec-based Dalsa which created conformal copper seed layers on through-silicon via structures (TSVs) using the eG ViaCoat process from
Alchimer.
Existing MEMS products have been fabricated using via-first TSV which supports 3D integration technologies.
“With Alchimer’s copper-based eG ViaCoat approach we can support consumer MEMS products with faster operating frequencies and higher power density with even lower resistance and higher thermal dissipation through TSV,” said Luc Ouellet, v-p of technology development at Dalsa Semiconductor.
This approach, said Ouellet, will allow Dalsa to mass produce MEMS devices in cost-sensitive markets.
Alchimer’s eG ViaCoat is an electrochemical coating process for the copper seed metallisation of TSVs used in advanced 3D packaging applications.