Read our full Mobile World Congress coverage
Nokia has been busy signing a number of important semiconductor supplier contracts this week as it confirms its plans for 3G HSPA handset platforms.
Hot on the heels of a major silicon partnership with Qualcomm are agreements with Broadcom and ST-Ericsson.
Nokia has selected Broadcom as a supplier for next generation 3G baseband, radio frequency and mixed signal chipsets.
The two parties will cooperate on technology, including Nokia modem technology.
"Today's announcement with Broadcom is a further example of Nokia's commitment to our diversified, multi-supplier chipset strategy," said Kai Oistamo, executive v-p for devices at Nokia.
Nokia and ST-Ericsson are working together to provide a Symbian-based reference platform on ST-Ericsson’s U8500 chip for HSPA (High-Speed Packet Access) capable 3G smartphones.
ST-Ericsson will provide first samples of the smartphone platform by the end of the first quarter of 2009.
The U8500, which relies on the Nomadik application-processor technology combined with an ARM dual-Cortex A9 CPU. This platform will now provide full support for the Symbian Foundation software.
“We are confident the U8500 will fuel the growth of Web-enabled multimedia handheld devices and are excited to be working with Nokia and the Symbian Foundation to bring the most innovative products to market,” said Monica de Virgiliis, v-p, wireless multimedia group.