The semiconductor industry was operating at very near full capacity for the leading edge processes and in the silicon foundries during Q32009. This is shown by today's SICAS (Semiconductor International Capacity Statistics) figures.
In Q309, the foundry industry was running at 91.9% of its capacity, according to SICAS, and 300mm wafer production was running at 96% of capacity.
Processes below 60nm were running at 93.5% of capacity in Q309. Processes from 80nm to 60nm were at 95.7% of capacity and, at 80nm - 60nm capacity utilisation was 90%.
As processes get more elderly, the capacity utilisation percentage diminished in Q309. Between 0.12 micron and 0.06 micron capacity utilisation was 84.6%; from 0.16-0.12 micron it was 86.4%; from 0.2-0.16 micron it was 82.7%; from 0.3-0.2 micron it was 81.6%; from 0.4-0.3 micron it's 73.6%; from 0.7-0.4 micron it was 65.8%; and over 0.7 micron it was 72%.
Overall MOS capacity utilisation was at 87.2% in Q309, says SICAS. Total capacity shrank by 1% between Q2 and Q309, but wafer starts were up 10% in Q3 on Q2, says SICAS.
The figures show that the much-trailed expectation of capacity shortages, allocation and higher ASPs is beginning to happen.
See also: Mannerisms, the blog of David Manners. Updated twice daily, it's the distinctive, entertaining, authoritative and never dull commentary on the semiconductor industry, from someone who knows. Sign up for the Mannerisms eNewsletter.