NEC Electronics and Toshiba have signed up to IBM's Semiconductor Alliance developing 28nm, high-k metal gate (HKMG) CMOS chip process technology.
The alliance, based at IBM’s facility in East Fishkill, New York, includes Chartered Semiconductor Manufacturing, Globalfoundries, Infineon Technologies, NEC Electronics, Samsung Electronics, STMicroelectronics and Toshiba.
The participation of NEC and Toshiba means IBM's 28nm process technology alliance now includes many of the world's largest chip manufacturers. The main manufacturers not involved being Intel, TSMC and Texas Instruments.
The aim of the project is to support the transition from 32nm to 28nm technology without the need for a major redesign.
“The advanced 28nm low-power process technology will dramatically enhance the product’s density, performance, as well as power consumption compared to the former 40nm node, providing highly competitive solutions, especially in the fields of consumer electronics and automotive.” said Masao Fukuma, senior v-p of NEC Electronics.
Toshiba first joined the IBM bulk semiconductor process technology development alliance in December 2007 and NEC Electronics joined in September 2008.