Oxford Advanced Surfaces Group has completed a project on a technique which will support the development of plastic electronic structures.
The materials technology company has been investigating techniques to address the interlayer delamination problems which can affect the manufacturer of plastic electronic devices.
As part of the Technology Strategy Board funded project it has developed a technique for the adhesion of inter-layers for multilayer flexible electronic devices.
The work was carried out in collaboration with project partners PETEC (Printable Electronics Technology Centre) and OMIC (Organic Materials Innovation Centre).
Significantly it uses a solution printing process.
There is now a plan to bring the technique to pilot production in the UK.
“The printed electronics market is forecasted to be in the order of $10bn by 2015 in multiple application areas from displays to photovoltaics,” said Mike Edwards, v-p of sales and marketing at OAS.
“The collaboration with PETEC has served as a concrete validation of our Onto interlayer adhesion technology and we look forward to continuing this relationship as we seek global licensing partners in the area of printed electronics,” said Edwards.
Oxford Advanced Surfaces Group develops and licenses intellectual property (IP) for the creation of engineered surface coatings and advanced materials.
www.oxfordsurfaces.com
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