CSR is working with packaging specialist Taiyo Yuden on a range of multi-radio Bluetooth, GPS and Wi-Fi modules.
In effect CSR will integrate its CSR9000 chipset into new types of shock-resistant, low-profile modules which can be designed into cameras and mobiles.
Taiyo Yuden’s packaging technology known as EOMIN will provide CSR with a new type of robust module for its silicon.
It also results in a much lower thermal resistance, which is claimed to be less than 20% of the resistance of alternative low temperature co-fired ceramic (LTCC) chip packaging.
“This results in significantly smaller modules,” said Matthew Phillips, senior v-p handset business unit, CSR.
“Our EOMIN technology allows multiple wireless functionality to be embedded onto the smallest possible module keeping the overall size of the device to a minimum,” said Mitsuo Takagi, general manager of the integrated module business at Taiyo Yuden.
The modules will be available from Q3 2009.
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