NXP has launched a range of Q101-qualified automotive power mosfets in SO-8 footprint package.
Dubbed LFPAK, the package was originally designed for use in DC-DC converters and uses a copper clip design rather than wire bonds to reduce internal resistance and inductance.
"LFPAK offers the designer a mosfet with similar electrical and thermal performance to DPAK, with a footprint 46% smaller," claimed NXP.
The automotive mosfets are 100% avalanche tested and AEC-Q101 qualified to 175°C.
Target applications include engine controllers, transmission controllers, brakes, water pumps and reverse battery protection.