Speed-enhanced GSM mobile phone technology, known as EDGE, is expected to continue to be a major market for chipset suppliers despite the steady rollout of 3G handsets based on W-CDMA technology.

EDGE with a theoretical data rate of 384kbit/s is being designed into dual mode 3G handsets which will support high speed services across the network even when W-CDMA technology is only partially installed.

“EDGE is key foundation for dual mode 3G handsets and I expect EDGE to be the fall back [in 3G rollout] for the next three to five years,” said Michael Dimelow, product marketing director for silicon at TTPCom.

Joint EDGE/W-CDMA networks will be a feature of the rollout phase for 3G, but they could also be more permanent should operators decide not to extend expensive 3G coverage to less highly populated areas.

Dimelow expects the availability of silicon to support the next all-important phase of 3G mobile rollout to increase during the year. “2007 is the timeframe most people are talking about,” said Dimelow.

TTPCom has already licensed its dual-mode W-CDMA/ EDGE mobile modem to a number of semiconductor suppliers including Intel and Analog Devices, and another is expected to adopt the technology in the near future.

The CBEmacro modem design combines TTPCom’s protocol IP with the ARM1156T2-S processor and AMBA bus fabric for design of dual-mode EDGE/W-CDMA or tri-mode EDGE/HSDPA (Cat 6, 8 and 10) baseband silicon.

The new licensee is expected to have dual-mode handsets on sale in Europe in 2007.
TTPCom said CBEmacro adopters can expect to sample silicon within nine months of project start.

Agere is another mobile phone chipset supplier which sees EDGE as a key technology to support 3G handset design.

According to Phil Carrier, marketing v-p for the mobile business at Agere Systems: “Where the money is being made is in GPRS and EDGE designs and this will continue to be the case for the next few years.”

www.ttpcom.com