Micron Technology has combined NAND flash and DRAM in a multi-chip packaged memory device which is aimed specifically at mobile phone designs.
Intended for use in next generation handsets, the package combines high-density NAND flash memory with the firm’s mobile DRAM technology.
According to Achim Hill, director of marketing for Micron’s Mobile Memory group: “To meet the market’s increasing demand for high density, small form factor, and low power devices, it’s a natural evolution for to create a NAND and DRAM packaging combination.”
Micron is sampling its high-density NAND and mobile DRAM multi-chip packaged devices to selected customers and are expected to be available in 1Gbit NAND/512Mbit Mobile DDR DRAM configurations for production in Q4 2006.
“Multi-chip packages will continue to expand beyond wireless handsets into emerging mobile multimedia devices,” added Hill.
The semiconductor firm plans to show the multi-chip memory devices at the 3GSM World Congress this month in Barcelona.
www.micron.com