IBM researchers have claimed a way to extend traditional
chip-manufacturing processes to generate smaller chip circuits,
potentially postponing the semiconductor industry’s high-risk
conversion to an alternative.
IBM scientists have created high-quality line patterns using
deep-ultraviolet (DUV) 193nm optical lithography for spaced ridges
29.9nm wide, below the 32nm point that industry consensus held as
the limit for optical lithography techniques.
According to IBM, the new result indicate that a "high-index
immersion" variant of DUV lithography may provide a path for
extending Moore’s Law further, thus buying the industry time before
it is forced to upgrade.
"Our goal is to push optical lithography as far as we can so the
industry does not have to move to any expensive alternatives until
absolutely necessary," said Dr Robert Allen, manager of lithography
materials at IBM’s Almaden Research Center.
 |
Lines with the sub-30nm spacing
|
"This result is the strongest evidence to date that the industry
may have at least seven years of breathing room before any radical
changes in chip-making techniques would be needed."
The 29.9nm lines and spaces were created on a lithography test
apparatus designed and built at IBM Almaden, using new materials
developed by its collaborator, JSR Micro.
"We believe that high-index liquid imaging will enable the
extension of today’s optical lithography through the 45- and
32-nanometer technology nodes," said Mark Slezak, technical manager
of JSR Micro.
"Our industry faces tough questions about which lithography
technology will allow us to be successful below 32 nanometers. This
new result gives us another data point favouring the continuation
of optical immersion lithography."
The first technical details of the 29.9nm circuit will be
presented this week at the SPIE Microlithography 2006 conference in
San Jose.
www.ibm.com