Altera has teamed with White Electronic Designs to offer specific FPGA package types aimed at military and aerospace customers.
As part of the agreement White Electronic Designs will package Altera FPGA die in packaging types that will include small form-factor monolithic plastic and ceramic, chip-on-board, multichip modules, stack and system-in-a-package (SiP).
The packaging options 
will support 90nm Stratix II and Cyclone II FPGA families. Support for next generation, 65nm FPGAs is also planned, said the firm.
According to Jack Bogdanski, director of marketing for defence microelectronics products at White Electronic Designs: “This brings FPGA capabilities to military systems designers in smaller form-factor packaging for applications requiring greater density and design flexibility than standard packaging allows.”
Altera already 
supports the COTS (commercial-off-the-shelf) requirements of the military and aerospace market with devices that support a wide range of temperature gradients, bare die business support, long-term obsolescence protection and a consistent supply chain.
“This expands our range of packaging options well beyond the competition’s and is a further demonstration of our enhanced COTS initiative,” said Don Faria, senior v-p of Altera’s business groups. “Offering small form-factor monolithic packaging more effectively aligns us with the needs of our military and aerospace customers.”