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3DLABS Semiconductor will be demonstrating its Windows CE board support package (BSP) for its programmable media processor at Embedded World in Nuremberg next week.

The DMS-02 programmable media processing array is based on a dual ARM architecture and is used in embedded consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices.

The Windows CE 5.0 BSP is supported on the DMS-02 development system which includes; UI features (800x480 24-bit LCD resistive touch screen, keyboard, mouse, buttons, microphone, headphone, line-in/out and speakers), connectivity (WiFi, USB), storage (2Gbyte NAND, NOR Flash, SDCard, SDHC/MMC+ slot,) and video I/O (HDMI TV encoder, analog TV encoder, VGA Camera).

According to Tim Lewis, director marketing, 3DLABS Semiconductor: "By combining our intimate knowledge of our DMS-02 processor with a Windows CE BSP we can jump-start the product development of our customers and partners working in the Microsoft Windows CE eco-system."

The DMS-02 media-rich applications processor is a multi-core system-on-chip that combines two ARM 926 cores with 3DLABS’s proprietary SIMD array processor and an industry standard set of peripheral functions.

The Windows CE 5.0 BSP and supported DMS-02 Development System are expected to ship to partners during Q1 2008.

See also: Electronics Weekly's focus on microprocessors, a roundup of content on microprocessor technologies and developments not related to the x86 architecture (from ARM, Texas Instruments and MIPS).