Using electron-beam direct write (EBDW) technology, IC prototyping service provider e-Shuttle said yesterday that it is now delivering 65nm CMOS logic ICs manufactured, in what it believes is the first full-scale application of EBDW techniques for complex logic ICs.

e-Shuttle, a joint venture of Fujitsu Microelectronics and Advantest, also said it is applying EBDW technology for devices using 90nm process technology to manufacture structured ASICs for a fabless semiconductor company in the US.

Producing single-layer via interconnect patterns using EBDW provides a short delivery cycle with mask-less production, and EB lithography has proven capable of producing yields comparable to optical lithography, the company noted.

e-Shuttle also said it will expand its capacity for electron beam products with the launch of a second EB lithography station set for mid-June, whereas its first lithography station, for full-scale 300-mm production, went into service in November 2007. The company expects the implementation of the second station to increase production capacity and help the company develop the technology for the next generation of ICs.

The 300-mm wafer shuttle service combines the orders of multiple customers in order to dramatically reduce costs. Via layers are formed using an electron beam direct write technique, which aims to reduce the costs involved in forming via layers for ultra-fine interconnects using masks. The company claims EBDW technology has achieved excellent results without compromising yield, and believes EB lithography and ArF lithography can coexist in the fabrication process.

Further, e-Shuttle said it is working with design house partners, including mask manufacturers Dai-Nippon Printing, Toppan Printing, and Hoya, to support customers that require IC prototyping. Tokyo Electron Devices also is acting as e-Shuttle's support partner in the prototyping service.

"The alliances between mask-less proponent e-Shuttle and mask makers are symbolic of the direction the industry is taking. These partnerships in Japan represent the company's first round of alliances; e-Shuttle will also pursue partnerships with international prototyping companies. We are now negotiating with prototyping companies in the U.S., Europe and China." He added that e-Shuttle is now working on EBDW for 40-nanometer process technology and expects to offer this capability by the end of fiscal 2008," said Dr. Haruo Tsuchikawa, president of e-Shuttle, in a statement.

By Ann Steffora Mutschler, Senior Editor - Electronic News