In order to shrink semiconductor mask cycle time and help control costs, Tokyo-based photomask maker Toppan Printing has said that it believes it is the first photomask maker to develop a 32nm photomask manufacturing process. It will begin volume production in June, with performance already demonstrated at chipmakers leading the migration to 32nm chips for digital cameras, mobile phones and other devices.

Toppan said it developed the photomasks by using new materials - also called blanks - and revising conventional materials and structures, while at the same time developing its manufacturing processes to maximise the features of the new materials.

By building on new binary type and new half-tone type leading-edge semiconductor manufacturing processes instead of conventional manufacturing processes for fine-pattern formulation, the process improves dimension accuracy.

Toppan stressed that the photomask allows binary-type wafer performance that matches the fine-pattern formulation and dimension accuracy of half-tone type wafers, produced with embedded attenuated phase shift masks.

"Our collaboration with customers, material suppliers and tool manufacturers has produced a new 32nm photomask solution that would have been difficult to develop on our own. We will continue to reinforce our alliances with these partners to offer new solutions to our global customers and to streamline and advance semiconductor technology development," added Toshiro Masuda, head of semiconductor solutions division and managing director of Toppan Printing, in a statement.

By Ann Steffora Mutschler, Senior Editor - Electronic News