Chip giant Intel, through its investment arm Intel Capital, was part of a $14.5 million round of funding for Oregon-based NexPlanar, which is working to commercialise the next generation of chemical mechanical planarization (CMP) pad technology for manufacturing semiconductor devices.

NexPlanar explained that it uses proprietary "nano-domain" technology to improve planarity and cross-wafer uniformity that can be used to customize the pads for specific applications, such as sensitive structures on a device by varying the hard and soft domains of the pad.

"Nano-lubricants" and patented molded groove technologies are meant to allow for low stress CMP - required for the most advanced CMP applications - resulting in an order of magnitude fewer defects, the use of low slurry consumption processing, the company also noted.

InterWest Partners led the round of investment, with other existing investors including BlueRun Ventures, Smart Forest Ventures, Fina Ventures and Entegris.

Jim LaCasse, CEO and president of NexPlanar explained in a statement, "As device geometries shrink, there must be a paradigm shift in the CMP process. Our proprietary pad technology enables advanced processes while offering significantly improved yields in existing processes. Our mandate is to improve the CMP yields by improving the planarity and reducing defects, while at the same time lowering cost of ownership by increasing the pad life and lowering slurry consumption."

NexPlanar's patent portfolio and technology is meant to allow new material integration in advanced devices as called for in the ITRS (International Technology Roadmap for Semiconductors).

The company manufactures in Hopkins, Minnesota as well as at its new headquarters in Hillsboro, Oregon.

By Ann Steffora Mutschler, Senior Editor - Electronic News