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STMicroelectronics and Infineon Technologies have joined up with 3-D packaging specialists STATS ChipPAC, to develop next-generation embedded Wafer-Level Ball Grid Array (eWLB) packaging technology. The three companies will jointly own the resulting IP.

eWLB technology uses a combination of front-end and back-end manufacturing techniques with parallel processing of all the chips on the wafer, leading to reduced manufacturing costs.

'This, together with the increased level of integration of the silicon's overall protective package, in addition to a dramatically higher number of external contacts, means the technology can provide significant cost and size benefits for makers of cutting-edge wireless and consumer products, says a joint statement from the three companies.

ST plans to use the technology in several products of its ST-NXP Wireless joint venture and in other application markets, with first samples expected by the end of 2008 and production by early 2010.

"The eWLB technology sets new milestones in innovation, cost competitiveness and dimensions", said Carlo Cognetti, Director, advanced packaging technology at ST.

"We see a shift in the packaging industry towards the energy efficient and high-performance eWLB technology," said Wah Teng Gan, vp of assembly & test at Infineon.

"The depth of technical expertise at Infineon and ST, combined with the knowledge we have on driving integration technology and flexibility at the silicon level, are essential to delivering this breakthrough technology" said Dr. Han Byung Joon, executive vp and CTO at STATS ChipPAC.

See also: Mannerisms, the blog of David Manners. Updated twice daily, it's the distinctive, entertaining, authoritative and never dull commentary on the semiconductor industry, from someone who knows. Sign up for the Mannerisms eNewsletter.