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Fujitsu reveals GaN transistor for power supplies

Thursday 02 July 2009 04:18

Fujitsu Laboratories has developed a GaN power transistor for mains PSUs, claiming it to have the highest current density yet.

GaN is inherently a fast technology, and the material withstands voltages better than both Si and GaAs.

This particular HEMT (high electron mobility transistor) has been engineered to be completely off when less than 2V is applied to the gate. "The technology blocks the flow of current from power supplies in stand-by mode," explained the firm, claiming: "GaN HEMTs have less than one-fifth the on-state loss of silicon transistors and have excellent high-speed characteristics, so that switching losses are less than 1% of those of silicon transistors."

In 2008, the Lab developed a RF power-HEMT for basestations with a three-layer cap structure by sandwiching an aluminium-nitride layer between n-type GaN layers.

This AlN layer produced a gate threshold voltage of 0.5V, "it could not be used for power supplies, which need to apply 2 to 4V in order to apply hundreds of volts at the drain", said Fujitsu. "In addition, power supplies effectively need to have an on-state current density of at least 600mA/mm.

Now the Lab has modified the 2008 structure

Now the Lab has modified the 2008 structure, developing a way to remove the cap layers and a part of the AlGaN layer, but only immediately below the gate.

"By leaving a thin n-type AlGaN layer on the GaN carrier layer, while suppressing damage to the GaN layer, on-state voltage can be increased beyond +2V while preserving the total interruption in stand-by, enabling high-speed performance when turned on," explained Fujitsu.

A gate was developed that uses an insulated structure with an atomically-flat oxide film "because this suppresses gate leak current in which travelling electrons flow to the gate electrode when turned on, a positive voltage can be applied to the gate electrode, resulting in high on-state current density," said Fujitsu.

Current density is 829mA/mm, double that of last year's design.

"Among transistors that can achieve an on-state voltage of at least 2V and completely interrupt current when off, Fujitsu's new transistor features the world's highest on-state current density, making it the first GaN HEMT that has the characteristics required for power supply use," claimed the firm.

The firm aims to be manufacturing PSUs using the transistor by approximately 2011.

Optional caption for optional figure Fujitsu4

Maximum current density and threshold voltage benchmarks for this transistor compared by Fujitsu with others with a breakdown-voltage of 100 V or higher, and a gate threshold voltage above 0V.

In 2008, Fujitsu revealed a similar transistor, but aimed at RF amplifiers in phone basestations.

HEMTs were invented in 1979 by Dr Takashi Mimura at Fujitsu Laboratories.

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