Tensilica has introduced a 1GHz dataplane processor (DPU) core
capavble of delivering 10Giga-MACs-per-second performance for
system-on-chip (SoC) designs.
The base Xtensa LX3 DPU configuration can reach speeds of over 1GHz
in 45nm process technology (45GS) with an area of 0.037sq. mm and
power of 0.015mW/MHz.
When built with the new ConnX Baseband Engine DSP (ConnX BBE), the
Xtensa LX3 processor delivers over 10Giga-MACs-per-second
performance, running at 625MHz with a footprint of 0.93mm(2) (post
place-and-route 45GS) and consuming 170mW (including leakage), said
the supplier.
"The Xtensa LX3 processor, Tensilica's flagship product," said Jack
Guedj, Tensilica's president and CEO. "We've invested heavily in
our DPU technology to make it smaller, easier to use, and up to 20
percent faster."
When comparing functionally equivalent configurations of the Xtensa
LX3 DPU versus the prior generation Xtensa LX2 DPU, the new Xtensa
LX3 processor delivers up to 15% faster clock speed, up to 20%
smaller die area and up to 15% less power using identical process
technologies and libraries.