The semiconductor industry was operating at very near full
capacity for the leading edge processes and in the silicon
foundries during Q32009. This is shown by today's SICAS (Semiconductor International
Capacity Statistics) figures.
In Q309, the foundry industry was running at 91.9% of its
capacity, according to SICAS, and 300mm wafer production was
running at 96% of capacity.
Processes below 60nm were running at 93.5% of capacity in Q309.
Processes from 80nm to 60nm were at 95.7% of capacity and, at 80nm
- 60nm capacity utilisation was 90%.
As processes get more elderly, the capacity utilisation
percentage diminished in Q309. Between 0.12 micron and 0.06 micron
capacity utilisation was 84.6%; from 0.16-0.12 micron it was 86.4%;
from 0.2-0.16 micron it was 82.7%; from 0.3-0.2 micron it was
81.6%; from 0.4-0.3 micron it's 73.6%; from 0.7-0.4 micron it was
65.8%; and over 0.7 micron it was 72%.
Overall MOS capacity utilisation was at 87.2% in Q309, says
SICAS. Total capacity shrank by 1% between Q2 and Q309, but wafer
starts were up 10% in Q3 on Q2, says SICAS.
The figures show that the much-trailed expectation of capacity
shortages, allocation and higher ASPs is beginning to happen.
See also:
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