Infineon Technologies and Nokia are partnering for the
development of advanced radio frequency (RF) transceivers to
support high speed wireless transmission.
The work will centre around Nokia’s wireless modem IP and
Infineon’s RF transceivers. The result will be a new class of
chipset to support the development of HSPA (high speed packet
access) and LTE (long term evolution) mobile networks.
The companies said they will "drive the interface
standardisation for LTE-Advanced enabling data rates of up to
1Gbit/s".
The expectation is that the incorporation of an open interface
will enable a fast roll out of HSPA and LTE networks.
According to Prof. Hermann Eul, member of the Infineon
management board: “Pairing Nokia’s advanced modem technology and
Infineon’s best in class RF transceiver solutions, will give the
industry access to very competitive chipset solutions.”
The agreement covers a non-exclusive collaboration to ensure the
compatibility and interworking of Nokia’s licensable baseband modem
technologies and Infineon’s RF devices.