First ARM processors fabricated on IBM’s 45nm silicon-on-insulator (SOI) process technology have been taped out.
These are prototype devices for customers but production silicon is likely to follow.
First silicon has been seen of ARM 1176 core-based processors.
This is a significant step along the road top more widespread use of SOI process technology which can have specific power and performance advantages over traditional bulk CMOS.
ARM has claimed potential power savings of up to 40% using a SOI 45nm process compared to bulk CMOS.
There is an expectation that SOI technology, which as been used in niche applications for a number of years, could have an impact on consumer and even mobile processors.
“We are seeing activity in specific consumer applications. We are at an interesting point in the industry right now,” Remy Pottier, marketing and business development manager at ARM told EW.
“SOI has definite advantages and so maybe we will also see (SOI) applications processors in the mobile space,” said Pottier.
Last year, ARM started work with French SOI wafer specialist Soitec on a programme to compare 45nm SOI technology with bulk CMOS 45nm low-power (LP) technology.
See: ARM forces rethink on low-power process technology
ARM has also made 18 physical IP blocks, verified for the IBM SOI process, available for license.
This is part of an SOI initiative involving IBM and Cadence Design Systems as well as ARM.
SOI is known to have definite power and performance advantages over commonly used bulk CMOS process technology.
But its mainstream adoption has been slow because of higher cost and a lack of process proven silicon intellectual property (IP).
See: IBM, ARM and Cadence act to make SOI chips cost-effective