Infineon Technologies and Nokia are partnering for the development of advanced radio frequency (RF) transceivers to support high speed wireless transmission.
The work will centre around Nokia’s wireless modem IP and Infineon’s RF transceivers. The result will be a new class of chipset to support the development of HSPA (high speed packet access) and LTE (long term evolution) mobile networks.
The companies said they will "drive the interface standardisation for LTE-Advanced enabling data rates of up to 1Gbit/s".
The expectation is that the incorporation of an open interface will enable a fast roll out of HSPA and LTE networks.
According to Prof. Hermann Eul, member of the Infineon management board: “Pairing Nokia’s advanced modem technology and Infineon’s best in class RF transceiver solutions, will give the industry access to very competitive chipset solutions.”
The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s licensable baseband modem technologies and Infineon’s RF devices.