You will ideally have experience in the design of RF and/or microwave ICs, although applications from candidates with component level RF/microwave PCB or MIC design experience will also be considered. In addition to IC design the position would also include PCB/MIC based circuit and sub-system design. Successful candidates would be expected to design in a range of technologies including:
GaAs MMIC
Multi-Chip Modules (MCMs)
SMT based design at RF & microwave frequencies to component level
Various substrate technologies including HDI FR4, thick and thin-film ceramic, LTCC
Experience in, or knowledge of, some of the following areas would also be an advantage:
High power microwave amplifier design
Passive component design (filters, couplers, baluns)
Low noise synthesiser design
Communications system design
Digital modulation schemes
AD/DA conversion
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