Designers continue to face problems with lead-free soldering, as well as safeguarding RoHS compliance. One well respected lead-free training house is still witnessing the following customer issues:
Major problems (as expected) with component stocks
o Segregation of stock (mixed up)
o Compliance - “change the label, no one will notice”
o Confirmation of compliance – “can the source be trusted?”
Production based issues
o Hidden stocks of lead based solder used in rework – “I will just keep this roll to do those odd jobs”
o Temperature profiles on wave and reflow – “this new stuff does not work on our (old ) profiles”
o PCB issues plating / finishes – there is a need to apply stock rotation and understand new metallurgy.
o Components melting – such as connectors
o Problems with the tip life when hand soldering
o Re-training of hand soldering skills and good soldering practice. Need to go back to basic soldering skills, i.e. leave tip well tinned when not in use, use correct size of tip. Use brass wire wipers with moderation.
Mix of technology
o Some PCB made with lead and lead-free causes major problems with component placement
Design characteristics
o Thermal management of design
o Thermal management of components and PCB. The extra 40° has highlighted a number of issues such as voiding, flux and flux cleaning, board delamination, popcorning, sub standard plastics, wire burnback
Directive Decoder
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