The latest Q5 interview is with Lumileds Luxeon product manager Sudhir Subramanya.
He talks about the future of LED packaging at Philips Lumileds design, including thermal conductivity, Luxeon V LEDs, and hex footprints.
The five short sharp questions this week are:
* Seoul Semiconductor has recently announced the P7, a large surface mount package with a lot of power handling. Does Lumileds have intellectual property that would allow it to match this package in thermal conductivity?
* You have the Luxeon V, Osram its Ostars, and Seoul its P7 - all multi-die packages. Do multi-die packages have a long term future or will single die packages replace them?
* Is Lumileds planning a physically larger package similar in construction to the Rebel?
* Coloured Luxeon V LEDs were fine, so why was the Luxeon V package unsuited to white LEDs with a lifetime comparable to, for example, Luxeon 1 white LEDs?
*Given the time again, could Lumileds have designed a package in the same hex footprint that would have given the full desired lifetime from white?
Read his answers in the full interview: Q5 interview - James Foster, XMOS Semiconductor
The full text of the interview can also be found here: Lumileds talks LED packaging - interview
Remember, you can read all the Electronics Weekly Q5 interviews. From ARM's chairman, Sir Robin Saxby, to touchscreen technology firm Zytronic's MD, Mark Cambridge, the business leaders share their particular insights on the UK electronics industry.
