Vishay has introduced a series of ceramic package bases for high-power LED die, with thermal resistance down to 3K/W, writes the Electronics Weekly Technology Editor, Steve Bush.The LSUB series is available in two configurations: 'standard', for conductive epoxy or thick solder (greater than 12μm) die attach, and 'offset' for thin (2-3μm) solder layers.LED and laser applications are expected, in automotive, industrial, and homes.
Designed to accommodate die that are approximately 1x1mm, the pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
Read the full article - LED substrates mount die to PCBs



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