Normally, silicon scaling is a good thing. Except when you are making power devices, as people working in the automotive semiconductor business explained at the Design Automation and Test in Europe (DATE) conference this week in Dresden.
Klaus Meder, president of the automotive electronics division at Robert Bosch, explained in his keynote speech that denser devices are causing headaches when it comes to ensuring the reliability of power semiconductors in cars. He showed heat maps of old versus new parts and how lower silicon area is causing stronger hot spots to build on the devices. This is not good news for an industry that is expecting to put a lot more electronics into cars.

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