The three companies have put $7.3 million into they 7 year-old Oregon State University spin-off to develop photo-resists for EUV.
Intel, TSMC and Samsung made a rather larger bet on ASML developing EUV – $6 billion.
But the ASML development has stalled while a light source of sufficient power is developed.
“We’re targeting a product for high-volume manufacturing in 2017,” says Inpria CEO Andrew Grenville.
The aim of ASML and Inpria is to hit the 7nm node
Inpria says it intends to hire ‘two or three’ new people.