LATEST ELECTRONICS DESIGN NEWS

Communications

• Nujira launches 4G handset chip to cut power by 50%

  

  “4G handsets may need to be charged two or three times a day, which will have a catastrophic impact on user adoption,” said Tim Haynes, CEO, Nujira

  Posted: 09 Feb 2012 | FULL ARTICLE

EDA and IP

• CEVA-XC323 DSP core design kit supports multi-standards

  The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance

  Posted: 02 Feb 2012 | FULL ARTICLE

Embedded Systems

• IAR targets growth in embedded tool market in Korea

  "We are very happy to see how well our business is developing in Asia,” says Stefan Skarin, CEO of IAR Systems

  Posted: 10 Feb 2012 | FULL ARTICLE

Legislation

• Government plans awareness campaign for RoHS recast

  UK Government’s Department of Business Innovation and Skills (BIS) has approached distributor Farnell as part of its plan to increase awareness of RoHS and WEEE recasts (RoHS 2 and WEEE 2)

  Posted: 18 Jan 2012 | FULL ARTICLE

Power

• Nujira will get its 4G chips fabbed at TowerJazz

  The launch of the NCT-L1100 modulator marks teh Cambridge-based firm's decison to develop a fabless business model to address the high volume, global smartphone and mobile device market

  Posted: 10 Feb 2012 | FULL ARTICLE

• Agilent uses reference clock multiplier for simpler PCIe test

  "The use of the reference clock multiplier significantly simplifies the receiver test setup," said the supplier

  Posted: 25 Jan 2012 | FULL ARTICLE