Mentor spotted with IC packaging tool
Richard Goering from EETimes has spotted that Mentor is about to move back into the chip packaging market. At the FSA’s SiP Conference, Per Viklund from Mentor apparently said he was charged with getting Mentor back into the market:
Viklund said the packaging tool will let users manage I/O planning, interconnect, functional verification, signal and power integrity, thermal and mechanical analysis, and manufacturing and test, all in a collaborative environment with IC design.
What’s interesting is the origins of the project – from Mentor’s purchase of Dansk Data Electronik. DDE was known for its high end (ish) PCB tools from the late ’90s, although used internally at the firm for a lot longer, with Ericsson said to be one of its bigger customers. And guess who used to be product and technical support manager at DDE? Yep, one Per Viklund.