Vishay ceramic package bases target high-power LED die
Vishay has introduced a series of ceramic package bases for high-power LED die, with thermal resistance down to 3K/W, writes the Electronics Weekly Technology Editor, Steve Bush.
The LSUB series is available in two configurations: ‘standard’, for conductive epoxy or thick solder (greater than 12?m) die attach, and ‘offset’ for thin (2-3?m) solder layers.
Designed to accommodate die that are approximately 1x1mm, the pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
LED and laser applications are expected, in automotive, industrial, and homes.
Read the full article – LED substrates mount die to PCBs