mannerisms

Ruminations on the electronics industry from David Manners, Senior Components Editor on Electronics Weekly.

ECSEL has $4.8bn for EU electronics

Following the EU10/100/20 microelectronics funding programme and the French government’s $3.5 billion Nano2017 initiative, the EC has now announced a new funding instrument for nanoelectronics, ECSEL, with a total budget of € 4.8 billion.

ECSEL combines EU, national and private investments into electronic components and systems research and manufacturing in Europe.

ECSEL’s estimated budget is €4.8 billion over the period 2014-2020: the EU and Member States will each contribute €1.2 billion, with industry contributing at least half of the remaining €2.4 billion. ECSEL will be launched in early 2014.

ECSEL is  a merger of the existing ENIAC (nanoelectronics) and ARTEMIS (embedded systems) joint technology initiatives, which together during the period 2008-2012 have funded over 100 projects worth in excess of €2.8 million. These projects brought together 2000 partners, 40% of which were small and medium-sized companies.

The 10/100/20 strategy pledges €10 billion public/private investment in research and manufacturing over the next seven years, with the aim of Europe holding 20% of the global chip production market by 2020.

The European semiconductor manufacturing industry committed €100 billion investment to support the strategy.

Five pilot lines, worth over €700 million, have been launched.

Nano2017 is a  public/private research & development strategy for the period 2013-2017.  € 3.5 billion will be invested in research and manufacturing in the Grenoble area.

Public authorities will cover almost one third of the bill: € 600 million financing from the national government, €400 million from the EU and €100 million from local authorities.

The program is led by STMicroelectronics and includes CEA-Leti, IBM and around 100 small and medium-sized companies from across the supply chain. STMicroelectronics alone will invest € 1.3 billion to double the production capacity of its 300mm fab in Crolles to around 7,000 silicon wafers a week.

Tags: development strategy, french government, nanoelectronics, private investments, technology initiatives

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