The Mark Of A Great CEO
The thing about great CEOs is that they bubble with enthusiasm about what their companies are up to.
Andy Grove, Pasquale Pistorio, Robin Saxby, Ulrich Schumacher, Scott McGregor and others of their quality would rattle on till the end of time about their companies’ projects and aspirations.
The same with Morris Chang at TSMC.
Last week he was on about how TSMC expects to begin its ramp of a 14nm finfet-based process in Q4 2013.
He boasted of his 89 tape-outs on 28nm, enthusing: “The first silicon of every tape out was fully functional.”
He extolled TSMC’s development of a 40nm high mobility p-channel transistor which delivers 30% better speed than TSMC’s current 40nm process for low voltage SoCs.
He went on about the TSMC-ARM collaboration on an ARM core made on TSMC’s 28nm high performance mobile (HPM) process which has achieved outstanding computing performance.
He banged on about TSMC’s moves into a sub-system which integrates passive components and bumps which, says Chang: “Reduces packages from nine to one, reduces cost and increases the memory bandwidth and the system speed.”
He talked up TSMC’s Bond on Trace (BoT) in-house development which reduces substrate bond pitch from 140 microns to 100 microns with significant cost savings from using standard infrared result, eliminating paths and potentially reducing net layers and product form factor.
He described how TSMC’s CMOS image sensors will move into manufacturing early next year on a 1.1 micron pixel process early for 8 megapixel products. “We have also demonstrated a 0.9 micron pixel for 16 Megapixel products to be released a year later,” he said.
And he didn’t even mention TSMC’s LED production plans.
The effect of such enthusiasm by a CEO is to give the impression of a vibrant company bursting with ideas and plans, instead of the impression given by too many wary, defensive, modern CEOs fretting that they’ll say the wrong thing.