Soaring Demand For TSV Packaging.
Can there really be soaring demand for 3D packaging? That’s what AMS says, and it’s backed up the claim with €25 million to establish a production line for it.
AMS is using through-silicon-via technology. Two die from different processes – for example a photodiode and a silicon signal-processor – can be bonded back-to-back and put in one package to save space and cut connection length.
Where is this soaring demand coming from?
Initially the line will produce devices for the medical imaging and mobile phone markets.