EUV Start-Up Backed By Intel, Samsung and Applied

Intel, Samsung and Applied are investing in an EUV photo-resist company called Inpria.

The three companies have put $7.3 million into they 7 year-old Oregon State University spin-off to develop photo-resists for EUV.

Intel, TSMC and Samsung made a rather larger bet on ASML developing EUV – $6 billion.

But the ASML development has stalled while a light source of sufficient power is developed.

“We’re targeting a product for high-volume manufacturing in 2017,” says Inpria CEO Andrew Grenville.

The aim of ASML  and Inpria is to hit the 7nm node

Inpria says it intends to hire ‘two or three’ new people.

Tags: asml, EUV, Intel, samsung, tsmc

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4 Comments

  1. martijn
    February 21, 2014 13:10

    indeed they are not in the business of competing with ASML, and if they were they wouldn’t get very far with 7M.

    Also the investors are “wrangling” on 450mm, absolutely not on EUV: if it would work tomorrow, the whole leading edge would be using it by monday.

  2. david manners
    February 21, 2014 14:17

    Good point about 450mm being the project delayed by wrangling and not EUV which is delayed by the light source, Martijn. I’ve changed the text appropriately and thanks for pointing that out.

  3. Mike Bryant
    February 21, 2014 12:56

    I think you might have the wrong end of the stick here David. I believe Inpria are one of several companies (including one in the UK, a Russian outfit and a LETI spinoff in Grenoble) looking to make the special resist materials needed for EUV, but only ASML are making the machines themselves.

    There is an alternative litho company looking for considerable funding but I don’t believe Inpria are involved in that.

  4. david manners
    February 21, 2014 14:20

    You’re right Mike they’re doing the photo-resist not the whole caboodle

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