Designed for use in high power switch mode power supplies, motor drives, uninterruptible power supplies, solar inverters and oil exploration, the power modules are also offered with extended temperature ranges.
SiC technology is designed for higher breakdown field strength and improved thermal conductivity compared to silicon material.
This enables improved performance characteristics in parameters including zero reverse recovery, temperature independent behavior, higher voltage capability and higher temperature operation.
Available in low profile packages, the majority of the new module product family uses aluminum nitride (AIN) substrates to enable isolation from the heat sink, which improves heat transfer to the cooling system.
The packages are designed for low switching losses, low input capacitance and to minimise parasitic inductance.
The new industrial temperature module family includes the following parameters and devices:
• 1200V boost chopper configuration, rated from 50 to 100 amp (Part numbers: APT100MC120JCU2 and APT50MC120JCU2)
• 1200V phase leg configuration, rated from 40 to 200 amp (Part numbers: APTMC120AM08CD3AG, APTMC120AM20CT1AG, and APTMC120AM55CT1AG)
• 600V neutral point clamped configuration, dedicated to three level inverters for solar or UPS applications, rated from 20 to 160 amp (Part numbers: APTMC60TLM14CAG, APTMC60TLM20CT3AG, APTMC60TLM55CT3AG, and APTMC60TL11CT3AG)
• Neutral point clamped configuration, 600V/1200V mixed voltage, rated from 20 to 50 amp (Part numbers: APTMC120HRM40CT3G and APTMC120HR11CT3G)
Microsemi’s SiC product portfolio includes Schottky diodes in both discrete and module packages, and power modules with a mix of SiC Schottky diodes and IGBT or MOSFET transistors in both standard and custom configurations.